新型航空电子系统总线互连技术发展探讨

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Discussion on the Development of Bus Interconnection Technology for New Avionics Systems

WANG Shuai， AN Yi-chun

（CETC Special Mission Aircraft System Engineering Co.， Ltd.， Chengdu， Sichuan， 610000， China）

Abstract： The bus interconnection technology of new avionics system is reviewed， and its development trend is discussed. The advantages and disadvantages of the integrated modular and distributed modular avionics system architecture are analyzed， and the characteristics of FC avionics bus technology， AFDX bus technology and TTE bus technology are compared. The distributed modular avionics platform based on TTE bus technology helps to resolve application conflicts， and has better real-time feature， scalability and reliability. The formulation of related specifications and the introduction of a wider network topology will further enhance its overall performance， making it undoubtedly the core avionics technology of the next generation.

Key words： Avionics Systems； Data Bus； Integrated Modular； Interconnection Technology

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